Nozzle assembly for a saw for semiconductors
AssigneeKoninklijke Philips Electronics N.V.
InventorsFrederik In't Veld, Atapol Pprajukamol, Johannes Savenije
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Abstract
A nozzle assembly (314) for directing flow of fluid across one or more semiconductor device cutting blades (318), comprising: one or more nozzles configured to protrude toward a cutting blade for cutting a semiconductor device; and a channel formed in each of the nozzles, the channel being configured to at least partially surround the cutting blade, so as to simultaneously direct flow of a fluid onto the cutting edge of the cutting blade and onto the sides of the cutting blade.
Claims9
A nozzle assembly for directing flow of a fluid across one or more semiconductor device cutting blades, comprising:
- one or more nozzles configured to protrude toward a cutting blade for cutting a semiconductor device;
- and
- a channel formed in each of the nozzles, the channel being configured to at least partially surround the cutting blade, so as to simultaneously direct flow of a fluid onto the cutting edge of the cutting blade and onto the sides of the cutting blade.
Dependencies are inferred from the claim text.