Board construction assembly for reducing sound transmission and method

A method for on-site fabrication of a wall, ceiling, or floor construction component/underlayment assembly, comprising:

• providing a first wall, ceiling or floor construction component;
• the first construction component having a length, a width, and a thickness;
• the first construction component having first and second major surfaces that are each defined by the length and the width of the first construction component;
• the first construction component having mechanical properties;
• providing a second wall, ceiling or floor construction component;
• the second construction component having a length, a width, and a thickness;
• the second construction component having first and second major surfaces that are each defined by the length and the width of the second construction component;
• the second construction component having mechanical properties;
• providing an underlayment means having a supplemental mechanical property for supplementing the mechanical properties of the first and second construction components;
• applying the underlayment means to the first major surface of the first construction component and securing the underlayment means to the first major surface of the first construction component to form an underlayment layer;
• overlaying the underlayment means and the first major surface of the first construction component with the second construction component;
• and
• securing the second construction component to the first construction component with the underlayment means sandwiched between the second and first construction components to form a wall, ceiling or floor assembly with the supplemental mechanical property of the underlayment means.