Method of manufacturing multi-layer wiring board

A method of manufacturing a multi-layer circuit wiring board, said method comprising:

• forming a first via-contact layer in a first film having a first conductor layer formed on one surface thereof, and a second conductor layer formed on another surface thereof, thereby electrically connecting said first conductor layer with said second conductor layer;
• forming a first wiring pattern in said first conductor layer, and forming a second wiring pattern in said second conductor layer;
• laminating a second film having a first insulating layer and a third conductor layer formed on said first insulating layer on said one surface of said first film in such a manner that said first insulating layer is in contact with said one surface of said first film;
• laminating a third film having a second insulating layer and a fourth conductor layer formed on said second insulating layer on the other surface of said first film in such a manner that said second insulating layer is in contact with said other surface of said first film;
• forming a second via-contact layer electrically connecting said third conductor layer with said first wiring pattern, and forming a third via-contact layer electrically connecting said fourth conductor layer with said second wiring pattern;
• forming a wiring pattern for mounting an IC on said first conductor layer;
• and
• forming a wiring pattern to be electrically connected with a printed wiring board on said second conductor layer.

A method of manufacturing a multi-layer circuit wiring board, said method comprising:

• forming a first via-contact layer in a first film having a first conductor layer formed on one surface thereof, and a second conductor layer formed on another surface thereof, thereby electrically connecting said first conductor layer with said second conductor layer;
• forming a first wiring pattern in said first conductor layer, and forming a second wiring pattern in said second conductor layer;
• laminating a second film having a first insulating layer and a third conductor layer formed on said first insulating layer on said one surface of said first film in such a manner that said first insulating layer is brought into contact with said one surface of said first film;
• laminating a third film having a second insulating layer and a fourth conductor layer formed on said second insulating layer on the other surface of said first film in such a manner that said second insulating layer is brought into contact with the other surface of said first film;
• forming a second via-contact layer electrically connecting said third conductor layer with said first wiring pattern, and forming a third via-contact layer electrically connecting said fourth conductor layer with said second wiring pattern;
• forming a predetermined wiring pattern respectively in said third conductor layer and in said fourth conductor layer;
• laminating a fourth film over said wiring pattern of said third conductor layer, said fourth film having a third insulating layer and a fifth conductor layer formed on said third insulating layer;
• laminating a fifth film over said wiring pattern of said fourth conductor layer, said fifth film having a fourth insulating layer and a sixth conductor layer formed on said fourth insulating layer;
• forming a fourth via-contact layer electrically connecting the wiring pattern of said third conductor layer with said fifth conductor layer, and forming a fifth via-contact layer electrically connecting the wiring pattern of said fourth conductor layer with said sixth conductor layer;
• forming a wiring pattern for mounting an IC on said fifth conductor layer;
• and
• forming a wiring pattern to be electrically connected with a printed wiring board on said sixth conductor layer.

A method of manufacturing a multi-layer circuit wiring board, said method comprising:

• (a) forming a first via-contact layer in a first film having a first conductor layer formed on one surface thereof, and a second conductor layer formed on another surface thereof, thereby electrically connecting said first conductor layer with said second conductor layer;
• (b) forming a first wiring pattern in said first conductor layer, and forming a second wiring pattern in said second conductor layer;
• (c) laminating a second film having a first insulating layer and a third conductor layer formed on said first insulating layer on said one surface of said first film in such a manner that said first insulating layer is brought into contact with said one surface of said first film;
• (d) laminating a third film having a second insulating layer and a fourth conductor layer formed on said second insulating layer on the other surface of said first film in such a manner that said second insulating layer is brought into contact with the other surface of said first film;
• (e) forming a second via-contact layer electrically connecting said third conductor layer with said first wiring pattern, and forming a third via-contact layer electrically connecting said fourth conductor layer with said second wiring pattern;
• (f) forming a predetermined wiring pattern respectively in said third conductor layer and in said fourth conductor layer;
• (g) laminating a fourth film over said wiring pattern of said third conductor layer, said fourth film having a third insulating layer and a fifth conductor layer formed on said third insulating layer;
• (h) laminating a fifth film over said wiring pattern of said second conductor layer, said fifth film having a fourth insulating layer and a sixth conductor layer formed on said fourth insulating layer;
• (i) forming a fourth via-contact layer electrically connecting the wiring pattern of said third conductor layer with said fifth conductor layer, and forming a fifth via-contact layer electrically connecting the wiring pattern of said fourth conductor layer with said sixth conductor layer;
• and
• repeating said steps (g) through (i) to thereby form a required number of layers to form a laminate;
• forming a wiring pattern for mounting an IC on an outermost conductor layer which is disposed on one surface of said laminate;
• and forming a wiring pattern to be electrically connected with a printed wiring board on another outermost conductor layer which is disposed on this other surface of said laminate.

A method of manufacturing a multi-layer circuit wiring board, said method comprising:

• forming a first via-contact layer in a first film having a first conductor layer formed on one surface thereof, and a second conductor layer formed on another surface thereof, thereby electrically connecting said first conductor layer with said second conductor layer;
• performing a patterning of said first conductor layer to form a first wiring pattern in said first conductor layer;
• laminating a second film having a first insulating layer and a third insulating layer on said first wiring pattern in such a manner that said first insulating layer is brought into contact with said first wiring pattern;
• forming a second via-contact layer in said second film, thereby electrically connecting said third conductor layer with said first wiring pattern;
• performing a patterning of said third conductor layer to form a second wiring pattern in said third conductor layer;
• laminating a third film having a second insulating layer and a fourth insulating layer on said second wiring pattern in such a manner that said second insulating layer is brought into contact with said second wiring pattern;
• forming a third via-contact layer in said third film, thereby electrically connecting said fourth conductor layer with said second wiring pattern;
• performing a patterning of said fourth conductor layer to form a third wiring pattern in said fourth conductor layer;
• and
• performing a patterning of said second conductor layer to form a fourth wiring pattern in said second conductor layer.