Electronic component transporting method
AssigneePanasonic Corporation
InventorsSeiichi Nakatani, Seiji Karashima, Takashi Kitae
Life of this patent
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Abstract
A pickup device comprising a pickup surface to which an electronic component retaining liquid is to be applied and capable of adjusting a wet area of the electronic component retaining liquid on the pickup surface is prepared, and the electronic component retaining liquid is applied to the pickup surface in a first step. The electronic component is retained on the pickup surface via the electronic component retaining liquid in a state where the wet area is extended in a second step.
Claims24
An electronic component transporting method comprising:
- a first step for preparing a pickup device comprising a pickup surface to which an electronic component retaining liquid is to be applied and capable of adjusting a wet area of the electronic component retaining liquid on the pickup surface and applying the electronic component retaining liquid to the pickup surface;
- and
- a second step for retaining the electronic component on the pickup surface via the electronic component retaining liquid in a state in which the wet area is extended.
An electronic component pickup device capable of retaining an electronic component in a freely detachable manner, comprising:
- a conductive layer;
- an insulation layer laminated on the conductive layer so as to comprise a pickup surface for retaining the electronic component on a surface thereof;
- an electrolytic solution provided on the pickup surface;
- and
- a power supply unit for applying a voltage in a switching manner between the electrolytic solution and the conductive layer, wherein
- the voltage supply unit applies a voltage higher than the voltage applied between the electrolytic solution and the conductive layer when the electronic component is held, between the electrolytic solution and the conductive layer when the electric component is separated.
Dependencies are inferred from the claim text.