Predicting IC manufacturing yield by considering both systematic and random intra-die process variations

A computer-readable storage medium storing instructions that when executed by a computer cause the computer to perform a method for predicting a manufacturing yield for a die within a semiconductor wafer, the method comprising:

• receiving a physical layout of the die;
• partitioning the die into an array of tiles;
• computing systematic variations for a quality indicative parameter across the array of tiles based on the physical layout of the die;
• applying a random variation for the quality indicative parameter to each tile in the array of tiles;
• and
• obtaining the manufacturing yield for the die based on both the systematic variations and the random variations.

An apparatus for predicting a manufacturing yield for a die within a semiconductor wafer, the apparatus comprising:

• a receiving mechanism configured to receive a physical layout of the die;
• a partitioning mechanism configured to partition the die into an array of tiles;
• a computing mechanism configured to compute systematic variations for a quality indicative parameter across the array of tiles based on the physical layout of the die;
• an applying mechanism configured to apply a random variation for the quality indicative parameter to each tile in the array of tiles;
• and
• an obtaining mechanism configured to obtain the manufacturing yield for the die based on both the systematic variations and the random variations.