Automatic design method of semiconductor integrated circuit, automatic design system of semiconductor integrated circuit, and semiconductor integrated circuit

An automatic design system of a semiconductor integrated circuit, comprising:

• a relieving unit configured to increase an interval between a plurality of wiring patterns provided on a chip region to relive a density of the wiring patterns, based on first reference information including a criterion about a restriction of wiring length and second reference information including a criterion for a reduction of defect;
• a chip verifying unit configured to verify a circuit characteristic for the result of the relief;
• and
• a thickening unit configured to perform a first thickening process to thicken the wiring pattern by using a first design rule having a first correction value for thickening the wiring pattern and a second thickening process to thicken the wiring pattern having been thickened in the first thickening process by using a second design rule having a second correction value higher than the first correction value.

A semiconductor integrated circuit comprising:

• a semiconductor substrate;
• a first wiring pattern having a shape of a band which is provided on the semiconductor substrate;
• a second wiring pattern having a shape of a band which is provided apart from the first wiring pattern in parallel therewith;
• and
• a third wiring pattern including a band-shaped portion disposed apart between the first and second wiring patterns and having a greater line width than the first and second wiring patterns, a first inclined portion which is linked to the band-shaped portion and has a width increased gradually toward a direction of an arrangement of the first wiring pattern in a direction of an extension of the band-shaped portion extended in parallel with the first wiring pattern, a second inclined portion which is linked to the first inclined portion and extended obliquely toward a direction of an arrangement of the second wiring pattern with respect to the direction of the extension of the band-shaped portion, and a wide portion which is linked to the second inclined portion, is extended in parallel with the band-shaped portion and has a greater line width than the band-shaped portion.