Back to results
US 2007/0168818 A1Published application
Semiconductor test device with heating circuit
AssigneeAgere Systems Inc.
InventorsSeung Kang, Subramanian Karthikeyan, Sailesh Merchant, Lisa Mullin
Life of this patent
Estimating the term…
Abstract
A semiconductor test device includes a test circuit having contacts for applying an electrical signal and measuring electrical parameters of the test circuit. The semiconductor test device also includes an integrally formed heating circuit comprising at least one circuit meander positioned adjacent the test circuit for raising a temperature within a portion of the test circuit.
Claims15
1-27. (canceled)
A method comprising the steps of:
- forming a semiconductor device including an integrated test circuit and a heating element;
- and
- applying AC power to the heating element to provide controlled heating of the test circuit while substantially avoiding electromigration in the heating element.
A method of testing a semiconductor fabrication process, the method comprising the steps of:
- forming a semiconductor device and an integrated heating element, the device including a test circuit formed using the semiconductor fabrication process;
- applying AC power to the heating element to provide controlled heating to the test circuit while substantially avoiding electromigration in the heating element;
- applying DC power to the test circuit;
- and
- measuring an electrical parameter of the test circuit.
2 more elements
A semiconductor test apparatus comprising:
- semiconductor device means including test circuitry integrated with a heating element;
- and
- means for applying AC power to the heating element so as to provide controlled heating of the test circuit while substantially avoiding electromigration in the heating element.
Dependencies are inferred from the claim text.