Capacitive ultrasonic probe device

A method for manufacturing a capacitive ultrasonic probe device including the following steps S1 through S7:

• a step for joining a silicon substrate on which many capacitive ultrasonic transducer cells are arrayed and formed to one side of a flexible printed substrate, and joining a silicon substrate on which many driving control circuits are arrayed and formed to the other face side thereof (S1);
• subsequently, a step for subjecting the silicon substrate on which many driving control circuits are arrayed and formed to dicing with a depth where the cutting edge of a dicing reaches the flexible printed substrate surface in increments of unit (S2);
• further, a step for subjecting the silicon substrate on which many capacitive ultrasonic transducer cells are arrayed and formed to dicing with a depth where the cutting edge of a dicing reaches the flexible printed substrate surface in increments of unit (S3);
• subsequently, a step for subjecting a FPC exposure portion to masking, and subjecting the silicon substrates to metal film coating to subject the side faces of both units to electroconductive coating processing (S4);
• a step for disposing this within a tube having a predetermined inside diameter, and forming a tube shaped structure made up of the cylindrical shaped flexible printed substrate, driving control circuit unit, and capacitive ultrasonic transducer unit along the tube wall (S5);
• further, a step for disposing another driving control integrated circuit substrate at the center portion of the inside diameter portion, performing wiring with the other driving control circuit units, and connection of a coaxial cable, and then filling a compound resin which excels in insulation and thermal conductivity therein (S6);
• and
• subsequently, a step for packaging the tubular shaped structure in a sheath, and filing an acoustic binding agent in the space between the tubular shaped structure and the sheath, and finally sealing this (S7).