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US 2007/0167803 A1Published application
Thermally enhanced ultrasound transducer system
AssigneeUST, Inc.
InventorsPerry Kaminski, Yu-Chi Chu
Life of this patent
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AssigneeUST, Inc.
InventorsPerry Kaminski, Yu-Chi Chu
Estimating the term…
A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.
A high intensity focused ultrasound transducer for transmitting ultrasound toward a front medium along a first dimension, the ultrasound having a first frequency of greater than 100 KHz and less than 10 MHz, the ultrasound of the first frequency having a first wavelength, the transducer comprising:
A high intensity focused ultrasound transducer for transmitting ultrasound toward a front medium along a first dimension, the ultrasound having a first frequency of greater than 100 KHz and less than 10 MHz, the ultrasound of the first frequency having a first wavelength, the transducer comprising:
A high intensity focused ultrasound transducer for transmitting ultrasound toward a front medium along a first dimension, the ultrasound having a first frequency of greater than 100 KHz and less than 10 MHz, the ultrasound of the first frequency having a first wavelength, the transducer comprising:
Dependencies are inferred from the claim text.