Pressure senstive adhesive composition
AssigneeKaneka Corporation
InventorsKazuhide Fujimoto, Kazuhiko Ueda
Life of this patent
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Abstract
The present invention has its object to provide a pressure sensitive adhesive composition which can be applied using no organic solvent or using almost no organic solvent and which manifests excellent pressure sensitive adhesion characteristics. This object can be achieved by a pressure sensitive adhesive composition which comprises, as essential constituents, the following: (A) an oxyalkylene polymer containing 0.3 to 0.7 equivalent of a hydrolyzable silyl group in each molecule and having a number average molecular weight of 15,000 to 100,000 (hydrolyzable silyl group-containing polymer); (B) a tackifier resin; (C) a curing catalyst.
Claims7
A pressure sensitive adhesive composition
- which comprises the following components (A), (B) and (C):
- (A) An oxyalkylene polymer which has a number average molecular weight of 15,000 to 100,000 and contains a hydrolyzable silyl group in each molecule, said polymer being obtained by introducing, into each molecule 0.3 to 0.7 equivalent of a hydrolyzable silyl group relative to the total amount of the functional groups in a precursor of said oxyalkylene polymer, said functional groups allowing introduction of the hydrolyzable silyl group into said oxyalkylene polymer (hereinafter, “hydrolyzable silyl group-containing polymer”);
- (B) A tackifier resin;
- (C) A curing catalyst.
Dependencies are inferred from the claim text.