Heat conductive silicone composition

A heat conductive silicone composition comprising the following components (A)˜(D):

• component (A):
• 100 parts by weight of an organopolysiloxane having at least two alkenyl groups in a molecule thereof, and having a viscosity of about 10˜100,000 mm2/s at 25° C.;
• component (B):
• an organohydrogenpolysiloxane having at least two hydrogen atoms bonded directly to silicon atoms in a molecule thereof, an amount of component (B) being such that a ratio of the total number of hydrogen atoms bonded directly to silicon atoms in component (B) to the total number of alkenyl groups in component (A) is in the range of about 0.8/1˜1.5/1;
• component (C):
• 500˜1200 parts by weight of a thermally conductive filler selected from aluminum powder and metal oxide powder;
• and
• component (D):
• 0.01˜10 parts by weight of a coupling agent selected from titanate-based coupling agents and aluminate-based coupling agents.