Conditioner device for conditioning polishing pad and chemical mechanical polishing apparatus including the same

A conditioner device comprising:

• a rotatable circular support plate including a support plate surface comprising a circular-shaped center area located about the rotational axis of the support plate surface, a ring-shaped mid area surrounding the center area, and a ring-shaped peripheral area surrounding the mid area;
• a plurality of radially-extending conditioning zones located within the mid area of the support plate surface, the pluraltiy of the conditioning zones occupying about 60% to 70% of the total area of the support plate surface;
• a plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support place surface;
• and
• a plurality of slurry passages comprising a first slurry passage that is circular and is defined by the center area, a second slurry passage that is a ring shape and is defined by the peripheral area, and a third slurry passage that is defined by the regions between the plurality of the conditioning zones and connects the respective first slurry passage and the second slurry passage.

A chemical mechanical polishing apparatus comprising:

• a rotatable platen;
• a polishing pad positioned on the platen;
• a rotatable wafer carrier for mounting and polishing a wafer, the wafer carrier facing the polishing pad;
• a slurry supply nozzle for supplying a slurry to the polishing pad;
• a rotatable conditioner device comprising a support plate surface, the support plate surface comprising a plurality of conditioning zones having a plurality of hard particles which are densely arranged within the conditioning zones and attached to the support plate surface, the hard particles for maintaining the surface roughness of the polishing pad, and slurry passages for providing spaces for slurry flows between the plurality of the conditioning zones, the plurality of the conditioning zones occupy about 60% to 70% of the total area of the support plate, and the slurry passages occupy about 30% to 40% of the total of the support plate;
• and
• a rotation axis comprising an arm to which the conditioner device is installed.

A conditioner device comprising:

• a rotatable support plate including a support plate surface comprising a center area located about the rotational axis of the support plate, a mid area surrounding the center area, and a peripheral area surrounding the mid area;
• a plurality of conditioning zones located within a portion of the mid area of the support plate surface;
• a plurality of hard particles which are densely arranged within the conditoning zones and are attached to the support plate surface;
• and
• a plurality of passage defined by said conditioning zones within which a slurry flows, the passages occupying a portion of the mid area which is not occupied by the conditioning zones, the center area and the peripheral area, the pluraltiy of passages occupying about 30% to 40% of the total area of the support plate surface and partitioning the plurality of conditioning zones.

A conditioner device comprising:

• a rotatable circular support plate including a support plate surface comprising a circular-shaped center area located about the rotational axis of the support plate surface, a ring-shaped mid area surrounding the center area, and a ring-shaped peripheral area surrounding the mid area;
• a plurality of radically-extending conditioning zones located within the mid area of the support plate surface;
• a plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support place surface;
• and
• a plurality of slurry passages comprising a first slurry passage that is circular and is defined by the center area, a second slurry passage that is a ring shape and is defined by the peripheral area, and a third slurry passage that is defined by the regions between the plurality of the conditioning zones and connects the respective first slurry passage and the second slurry passage.
• wherein the plurality of the conditioning zones are shaped such that the conditioning zone of which boundaries extend along straight lines from the rotation axis of the support plate to the peripheral edge of the support plate, the azimuthal dimension of the conditioning zone gradually increasing with the radical distances from the rotation axis of the support plate.

A conditioner device comprising:

• a rotatable circular support plate including a support plate surface comprising a circular-shaped center area located about the rotational axis of the support plate surface, ring-shaped mid area surrounding the center area, and a ring-shaped peripheral area surrounding the mid area;
• a plurality of radically-extending conditioning zones located within the mid area of the support plate surface;
• a plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support place surface;
• and
• a plurality of sluury passages comprising a first slurry passage that is circular and is defined by the center area, a second slurry passage that is a ring shape and is defined by the peripheral area, and a third slurry passage that is defined by the regions between the plurality of the conditioning zones and connects the respective first slurry passage and the second slurry passage,
• wherein the plurality of the conditioning zones are shaped such that the conditioning zone of which boundaries extend along curved lines from the rotation axis of the support plate to the peripheral edge of the support plate, the azimuthal dimension of the conditioning zone gradually increasing with the radical distances from the rotation axis of the support plate.

A conditioner device comprising:

• a rotatable circular support plate including a support plate surface comprising a circular-shaped center area located about the rotational axis of the support plate surface, a ring-shaped mid area surrounding the center area, and a ring-shaped peripheral area surrounding the mid area;
• a plurality of radically-extending conditioning zones located within the mid area of the support plate surface;
• a plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support place surface;
• and
• a plurality of slurry passage comprising a first slurry passage that is circular and is defined by the center area, a second slurry passage that is a ring shape and is defined by the peripheral area, and a third slurry passage that is defined by the regions between the plurality of the conditioning zones and connects the respective first slurry passage and the second slurry passage,
• wherein the plurality of the conditioning zones are shaped such that the conditioning zone which extends in the azimuthal direction of the support plate, the radial dimension of the conditioning zone being substantially constant at any azimuthal location.

A conditioner device comprising:

• a rotatable circular support plate including a support plate surface comprising a circular-shaped center area located about the rotational axis of the support plate surface, a ring-shaped mid area surrounding the center area, and a ring-shaped peripheral area surrounding the mid area;
• a plurality of radically-extending conditioning zones located within the mid area of the support plate surface;
• a plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support place surface;
• and
• a plurality of slurry passages comprising a first slurry passage that is circular and is defined by the center area, a second slurry passage that is a ring shape and is defined by the peripheral area, and a third slurry passage that is defined by the regions between the plurality of the conditioning zones and connects the respective first slurry passage and the second slurry passage, the slurry passages occupying about 30% to 40% of the total area of the support plate surface.

A chemical mechanical polishing apparatus comprising:

• a rotatable platen;
• a ploishing pad positioned on the platen;
• a rotatable wafer carrier for mounting and polishing a wafer, the wafer carrier facing the polishing pad;
• a slurry supply nozzle for supplying a slurry to the polishing pad;
• a rotatable conditioner device comprising a support plate surface, the support plate surface comprising a plurality of conditioning zones having a plurality of hard particles which are densely arranged within the conditioning zones and attached to the support plate surface, the hard particles for maintaining the surface roughness of the polishing pad, and slurry passages for providing spaces for slurry flows between the plurality of the conditioning zones, the plurality of conditioning zones being arranged in a radical direction and occupying a portion of a mid area of the support plate, the mid area being located between a center area and a peripheral area of the support plate;
• and
• a rotation axis comprising an arm to which the conditioner device is installed.