Multi-zone carrier head for chemical mechanical polishing and cmp method thereof
OwnerYu-Hsiang Tseng, Kai-Hung Alex See +4inventors
InventorsYu-Hsiang Tseng, Kai-Hung Alex See, Mei-Sheng Zhou, Jin Yu, Zheng Zou, Wen-Zhan Zhou
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Abstract
A multi-zone carrier head includes a housing; a retaining ring secured to a lower edge of the housing; a backing plate having a plurality of non-concentric pressure zones defined by a plurality of isolated apertures on the backing plate; wherein the backing plate has a wafer side and a non-wafer side, the wafer side facing a backside of a wafer during a CMP operation; and a plurality of pneumatic bladder for independently controlling pressure exerted in the respective non-concentric pressure zones on the backside of the wafer during the CMP operation.
Claims14
A multi-zone carrier head for chemical mechanical polishing (CMP), comprising:
- a housing;
- a retaining ring secured to a lower edge of the housing;
- a backing plate having a plurality of non-concentric pressure zones defined by a plurality of isolated apertures on the backing plate;
- wherein the backing plate has a wafer side and a non-wafer side, the wafer side facing a backside of a wafer during a CMP operation;
- a pneumatic means for independently controlling pressure exerted in the respective non-concentric pressure zones on the backside of the wafer during the CMP operation;
- and
- a pressure-sensing element disposed under the pneumatic means in the respective non-concentric pressure zones.
(canceled)
A method for polishing a substrate, comprising:
- mounting a substrate into a carrier head, the carrier head comprising a pneumatic means controlled by a control unit for independently controlling pressure exerted in respective non-concentric pressure zones on backside of the substrate and a pressure-sensing element under the pneumatic means in the respective non-concentric pressure zones;
- respectively rotating the carrier head and a polishing pad on which the substrate is resting;
- providing a down force on the substrate;
- and
- polishing a material layer of the substrate away.
(canceled)
Dependencies are inferred from the claim text.