Multi-layer printed circuit board, and method for detecting errors in laminating order of layers thereof

A method for detecting errors in laminating order of layers of a multi-layer printed circuit board, comprising:

• preparing a multi-layer printed circuit board including a plurality of conductive layers and a plurality of dielectric layers disposed alternately with the conductive layers;
• defining a first conductive line, a first conductive reference surface, and a first through-hole respectively on three adjacent ones of the conductive layers in such a manner that the first conductive line, the first conductive reference surface, and the first through-hole are aligned in a normal direction relative to the multi-layer printed circuit board;
• coupling a Time Domain Reflectometer (TDR) to the first conductive line and the first conductive reference surface so as to form a first signal transmission line between the first conductive line and the first conductive reference surface;
• and
• sending a pulsed signal into the first conductive line through the TDR so as to measure characteristic impedance of the first signal transmission line.