Method for minimizing the instalation height of electrical components

A method of minimizing the installation height of an electrical component on a primary circuit board, said method comprising the steps of:

• (a) providing a primary circuit board having a thickness dimension, a first surface with a plurality of electrical contact sites for providing operative electrical connections, a second surface, and an aperture for providing access space for an electrical component;
• (b) providing a daughter board having a first surface with a plurality of electrical contact sites and at least one electrical component operatively attached thereon;
• and
• (c) attaching the daughter board to the primary circuit board with the first surface of the daughter board facing the first surface of the primary circuit board with the electrical contact sites of both intercoupled to provide ohmic coupling therebetween, and the electrical component passing through the aperture on the primary circuit board whereby the height of the electrical component above the second surface of the primary circuit board is reduced by the thickness of the primary circuit board.

A method of minimizing the installation height of an electrical component on a half-height form factor circuit board, said method comprising the steps of:

• (a) providing the half-height form factor circuit board having a thickness dimension, a first surface with a plurality of electrical contact sites for providing operative electrical connections, a second surface, and an aperture for providing access space for an electrical component;
• (b) providing a daughter board having a first surface with a plurality of electrical contact sites and at least one electrical component operatively attached thereon;
• and
• (c) attaching the daughter board to the half-height form factor circuit board with the first surface of the daughter board facing the first surface of the half-height form factor circuit board with the electrical contact sites of both intercoupled to provide ohmic coupling therebetween, and the electrical component passing through the aperture on the half-height form factor circuit board whereby the height of the electrical component above the second surface of the half-height form factor circuit board is reduced by the thickness of the half-height form factor circuit board .

A method of minimizing the installation height of an electrical component on an advanced mezzanine card, said method comprising the steps of:

• (a) providing the advanced mezzanine card having a thickness dimension, a first surface with a plurality of electrical contact sites for providing operative electrical connections, a second surface, and an aperture for providing access space for an electrical component;
• (b) providing a daughter board having a first surface with a plurality of electrical contact sites and at least one electrical component operatively attached thereon;
• and
• (c) attaching the daughter board to the advanced mezzanine card with the first surface of the daughter board facing the first surface of the advanced mezzanine card with the electrical contact sites of both intercoupled to provide ohmic coupling therebetween, and the electrical component passing through the aperture on the advanced mezzanine card whereby the height of the electrical component above the second surface of the advanced mezzanine card is reduced by the thickness of the advanced mezzanine card.