Back to results
US 2007/0167029 A1Published application
Thermal processing system, components, and methods
OwnerJeffrey Kowalski, Jeffrey Kowalskiinventors
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
OwnerJeffrey Kowalski, Jeffrey Kowalskiinventors
Estimating the term…
Thermal treatment is an important process in the manufacture of integrated circuits. As integrated circuits evolve to become smaller and faster, there is an increasing need to for higher precision thermal treatment systems that can efficiently and uniformly heat these circuits without damaging them. Accordingly, the present inventors devised, among other things, an exemplary thermal treatment system that includes a microwave-reflective containment chamber, an inner microwave-transparent process chamber within the containment chamber, a microwave-transparent wafer carrier within the process chamber; and a 5.8 Gigahertz microwave source for introducing microwave radiation within the outer chamber. The system can be used to efficiently oxidize a batch of vertically stacked of silicon wafers using a 10% concentration of ozone.
Apparatus comprising:
Apparatus comprising:
Apparatus comprising:
A method of heating two or more silicon wafers, the method comprising:
A method comprising:
A method comprising microwaving a plurality of silicon wafers using multimodal microwave energy wherein the energy is reflected off at least 5 substantially vertical sidewalls of a chamber enclosing the wafers.
Dependencies are inferred from the claim text.