Methods for forming conductive vias in semiconductor device components
AssigneeMicron Technology, Inc.
InventorNishant Sinha
Life of this patent
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Abstract
A method for forming conductive vias in a substrate of a semiconductor device component includes forming one or more holes, or apertures or cavities, in the substrate so as to extend only partially through the substrate. A barrier layer, such as an insulative layer, may be formed on surfaces of each hole. Surfaces within each hole may be coated with a seed layer, which facilitates adhesion of conductive material within each hole. Conductive material is introduced into each hole. Introduction of the conductive material may be effected by deposition or plating. Alternatively, conductive material in the form of solder may be introduced into each hole.
Claims23
A method for forming a conductive via in a semiconductor device component, comprising:
- providing a substrate having a first surface and an opposite, second surface;
- forming at least one hole partially through the substrate, the at least one hole defined by a sidewall and extending from the first surface of the substrate to the opposite, second surface of the substrate;
- applying a seed layer for facilitating adhesion of a conductive material to the first surface of the substrate, the opposite, second surface of the substrate and the sidewall of the at least one hole;
- removing a portion of the seed layer overlying the first surface and the opposite, second surface of the substrate;
- applying conductive material to a portion of the seed layer within the at least one hole;
- and
- introducing a filler material into a remaining space within the at least one hole.
The method of claim I, further comprising:
- forming at least one bond pad overlying at least a portion of the conductive via on at least one of the first surface and the opposite, second surface after introducing the filler material.
A method for forming a conductive via in a substrate comprising:
- providing a substrate having a first surface and an opposite, second surface;
- forming at least one cavity in the first surface of the substrate, the at least one cavity extending partially through the substrate;
- introducing a conductive filler material into a remaining space of the at least one cavity;
- and
- forming a barrier layer on surfaces of the at least one cavity.
Dependencies are inferred from the claim text.