Microelectronic interconnect device comprising localised conductive pins

A method to produce conductive rods on an electronic component comprising one or more conductive blocks, each of the conductive rods being in at least partial contact with a block of the electronic component, the method comprising:

• deposition of a conductive base on the component;
• deposition of a masking layer on the conductive base;
• formation in the masking layer of a plurality of holes, at least one conductive block of the conductive blocks being located opposite one or more holes;
• filling of the holes with a conductive material base, by electrolysis and using the conductive base as an electrode, to form the conductive rods;
• and
• removal of the masking layer.