Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, comprising:

• providing a semiconductor substrate comprising a first surface and a second surface;
• attaching a supporting body to the first surface of the semiconductor substrate using an adhesive layer disposed between the supporting body and the first surface of the semiconductor substrate;
• forming an opening in the semiconductor substrate from the second surface of the semiconductor substrate to expose a portion of the adhesive layer;
• and
• separating the supporting body from the semiconductor substrate by supplying a solvent to the exposed portion of the adhesive layer so as to dissolve the adhesive layer.

A method of manufacturing a semiconductor device, comprising:

• providing a semiconductor substrate comprising an insulation film formed on a front surface thereof and a pad electrode formed on the insulation film;
• attaching a supporting body to the front surface of the semiconductor substrate using an adhesive layer disposed between the supporting body and the front surface of the semiconductor substrate;
• removing part of the semiconductor substrate and part of the insulation film to expose the pad electrode;
• forming a wiring layer electrically connected with the exposed pad electrode;
• forming a protection film on a back surface of the semiconductor substrate to cover the wiring layer;
• removing a portion of the semiconductor substrate to expose a portion of the adhesive layer;
• and
• separating the supporting body from the semiconductor substrate by supplying a solvent to the exposed portion of the adhesive layer so as to dissolve the adhesive layer.

A method of manufacturing a semiconductor device, comprising:

• forming a groove in a semiconductor substrate form a front surface thereof;
• attaching a supporting body to the front surface of the semiconductor substrate having the groove formed therein using an adhesive layer disposed between the supporting body and the front surface of the semiconductor substrate;
• forming an opening in the semiconductor substrate from a back surface thereof so that the opening is connected with the groove to expose a portion of the adhesive layer;
• and
• separating the supporting body from the semiconductor substrate by supplying a solvent to the exposed portion of the adhesive layer so as to dissolve the adhesive layer.

A method of manufacturing a semiconductor device, comprising:

• forming a groove in a semiconductor substrate form a front surface thereof;
• attaching a supporting body to the front surface of the semiconductor substrate having the groove formed therein using an adhesive layer disposed between the supporting body and the front surface of the semiconductor substrate;
• thinning the semiconductor substrate by grinding a back surface of the semiconductor substrate so as to expose a portion of the adhesive layer;
• and
• separating the supporting body from the semiconductor substrate by supplying a solvent to the exposed portion of the adhesive layer so as to dissolve the adhesive layer.