Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact thin film integrated circuit device

A method for manufacturing a thin film integrated circuit device comprising the steps of:

• forming a peel-off layer over a substrate;
• forming a base film over the peel-off layer;
• forming a plurality of thin film integrated circuit devices over the base film;
• forming a groove at a boundary between the plurality of thin film integrated circuit devices;
• attaching a jig to an upper portion of the plurality of thin film integrated circuit devices;
• introducing a gas or a liquid containing halogen fluoride into the groove, thereby removing the peel-off layer, thereby separating the plurality of thin film integrated circuit devices;
• and
• removing the jig attached to the plurality of thin film integrated circuit devices.

A method for manufacturing a thin film integrated circuit device comprising the steps of:

• forming a peel-off layer over a substrate;
• forming a plurality of thin film integrated circuits over the base film;
• forming a heat-resistant insulating film over the plurality of thin film integrated circuits, thereby forming the plurality of thin film integrated circuit devices;
• forming a groove at a boundary between the plurality of thin film integrated circuit devices;
• and
• introducing a gas or a liquid containing halogen fluoride into the groove, thereby removing the peel-off layer, thereby separating the plurality of thin film integrated circuit devices.

A method for manufacturing a thin film integrated circuit device comprising the steps of:

• forming a peel-off layer over a substrate;
• forming a base film over the peel-off layer;
• forming a plurality of thin film integrated circuit over the base film;
• forming a heat-resistant insulating film over the plurality of thin film integrated circuit, thereby forming the plurality of thin film integrated circuit devices;
• forming a groove at a boundary between the plurality of thin film integrated circuit devices;
• attaching a jig to an upper portion of the plurality of thin film integrated circuit devices;
• introducing a gas or a liquid containing halogen fluoride into the groove, thereby removing the peel-off layer, thereby separating the plurality of thin film integrated circuit devices;
• and
• removing the jig attached to the plurality of thin film integrated circuit devices.

A method for manufacturing a noncontact thin film integrated circuit device comprising the steps of:

• forming a peel-off layer over a substrate;
• forming a base film over the peel-off layer;
• forming a plurality of thin film integrated circuits over the base film;
• forming a heat-resistant insulating film over the plurality of thin film integrated circuits, thereby forming a plurality of thin film integrated circuit devices;
• forming a groove at a boundary between the plurality of thin film integrated circuit devices;
• introducing a gas or a liquid containing halogen fluoride into the groove, thereby removing the peel-off layer, thereby separating the plurality of thin film integrated circuit devices;
• and
• forming an antenna on an upper or lower portion of the plurality of thin film integrated circuit devices.

A method for manufacturing a noncontact thin film integrated circuit device comprising the steps of:

• forming a peel-off layer over a substrate;
• forming a base film over the peel-off layer;
• forming a plurality of thin film integrated circuits over the base film;
• forming a heat-resistant insulating film over the plurality of thin film integrated circuits, thereby forming a plurality of thin film integrated circuit devices;
• forming a groove at a boundary between the plurality of thin film integrated circuit devices;
• attaching a jig to an upper portion of the plurality of thin film integrated circuit devices;
• introducing a gas or a liquid containing halogen fluoride into the groove, thereby removing the peel-off layer, thereby separating the plurality of thin film integrated circuit devices;
• removing the jig attached to the plurality of thin film integrated circuit devices;
• and
• forming an antenna on an upper or lower portion of the plurality of thin film integrated circuit devices.

A method for manufacturing a noncontact thin film integrated circuit device comprising the steps of:

• forming a peel-off layer over a substrate;
• forming a base film over the peel-off layer;
• forming a plurality of thin film integrated circuit devices over the base film;
• forming a groove at a boundary between the plurality of thin film integrated circuit devices;
• introducing a gas or a liquid containing halogen fluoride into the groove, thereby removing the peel-off, thereby separating the plurality of thin film integrated circuit devices;
• and
• enfolding at least one of the thin film integrated circuit devices with a substrate provided with an antenna.

A method for manufacturing a noncontact thin film integrated circuit device comprising the steps of:

• forming a peel-off layer over a substrate;
• forming a base film over the peel-off layer;
• forming a plurality of thin film integrated circuit devices over the base film;
• forming a groove at a boundary between the plurality of thin film integrated circuit devices;
• attaching a jig to an upper portion of the plurality of thin film integrated circuit devices;
• introducing a gas or a liquid containing halogen fluoride into the groove, thereby removing the peel-off layer, thereby separating the plurality of thin film integrated circuit devices;
• removing the jig attached to the plurality of thin film integrated circuit devices;
• and
• enfolding at least one of the thin film integrated circuit devices with a substrate provided with an antenna.

A noncontact thin film integrated circuit device comprising:

• a thin film integrated circuit formed over a substrate with a base film interposed therebetween;
• a heat-resistant insulating film formed over the thin film integrated circuit;
• and
• an antenna formed over or under the thin film integrated circuit.

A noncontact thin film integrated circuit device comprising:

• a thin film integrated circuit formed over a substrate with a base film interposed therebetween;
• and
• a heat-resistant insulating film formed over the thin film integrated circuit;
• a substrate provided with an antenna,
• wherein the thin film integrated circuit is enfolded with the substrate and connected to the antenna.

A coin comprising a noncontact thin film integrated circuit device, the noncontact thin film integrated circuit device comprising:

• a thin film integrated circuit formed over a substrate with a base film interposed therebetween;
• a heat-resistant film formed over the thin film integrated circuit;
• and
• an antenna formed over or under the plurality of thin film integrated circuit,
• wherein a part of components of the coin has a function of the antenna.