A method of fabricating a semiconductor device, comprising:
- preparing a substrate including a storage capacitor region and a higher voltage resistance capacitor region;
- forming a lower electrode layer on the storage capacitor region and the higher voltage resistance capacitor region;
- forming a first dielectric film on the lower electrode layer;
- selectively removing the first dielectric film of the storage capacitor region to expose the lower electrode layer of the storage capacitor region;
- forming a second dielectric film on the first dielectric film and the exposed lower electrode layer of the storage capacitor region;
- and
- forming an upper electrode layer on the second dielectric film.