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US 2007/0166883 A1Published application
Method of wafer level packaging and cutting
AssigneeTouch Micro-System Technology Inc.
InventorShun-Ta Wang
Life of this patent
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Abstract
A packaging wafer has a plurality of cavities and a plurality of trenches on a front surface thereof. The packaging wafer is bonded to the element wafer, and a first cutting method is performed. Afterward a piece of tape is provided and is attached to the packaging wafer. Moreover, a second cutting process is performed and then the piece of tape is removed. Therefore, a wafer level package is formed. In addition, the wafer level package is divided into a plurality of individual packages.
Claims27
A method of wafer level packaging and cutting, comprising:
- providing a packaging wafer, the packaging wafer comprising a plurality of cavities on a front surface thereof;
- performing a pre-cutting process upon the front surface and forming a plurality of trenches between the cavities and a plurality of partitions between the trenches and the cavities, wherein the packaging wafer has a thickness greater than a depth of the trenches;
- providing an element wafer, the element wafer having a plurality of devices and a plurality of bonding pads on a surface of the element wafer;
- bonding the packaging wafer and the element wafer;
- and
- performing a cutting process along the trenches upon the packaging wafer, thereafter using a piece of tape to remove an unbound part of the packaging wafer to expose the bonding pads of the element wafer, and accordingly forming a wafer level package.
3 more elements
A method of wafer level packaging and cutting, comprising:
- providing a packaging wafer, the packaging wafer comprising a transparent substrate, a pattern disposed on a front surface of the transparent substrate, and a plurality of cavities, which are defined by the pattern, disposed on the front surface of the transparent substrate;
- performing a pre-cutting process upon the front surface of the packaging wafer, and forming a plurality of trenches between the cavities and a plurality of partitions between the trenches and the cavities, wherein the packaging wafer has a thickness greater than a depth of the trenches;
- providing an element wafer, the element wafer comprising a plurality of devices and a plurality of bonding pads on a surface of the element wafer;
- performing a hermetical bonding process to bond the packaging wafer and the element wafer to form a plurality of hermetic windows;
- performing a first cutting process along a part of the trenches upon the packaging wafer;
- providing a piece of tape and attaching the piece of tape to the packaging wafer;
- performing a second cutting process along the other part of the trenches upon the wafer;
- removing the piece of tape along with an unbound part of the packaging wafer to expose the bonding pads, and accordingly forming a wafer level package;
- and
- dividing the wafer level package to form a plurality of individual packages.
7 more elements
Dependencies are inferred from the claim text.