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US 2007/0166878 A1Published application
Package structure and method for fabricating the same
OwnerChiu-Feng Liinventor
Life of this patent
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Abstract
A method for forming a package structure is disclosed. First, a wafer is provided, in which the front surface of the wafer includes a plurality of die areas and a plurality of scribe lines. Next, a plurality of cavities is formed on a back surface of the wafer with respect to the die areas, in which each die area includes a cavity. A dicing process is performed thereafter to dice the wafer along the scribe lines for forming a plurality of dies. A heat dissipating device has at least one portion disposed in the cavity of each die thereafter.
Claims11
A method for forming package structures, comprising:
- providing a wafer, wherein a front surface of the wafer comprises a plurality of die areas and a plurality of scribe lines;
- forming a plurality of cavities on a back surface of the wafer with respect to the die areas, wherein each die area comprises a cavity;
- dicing the wafer along the scribe lines for forming a plurality of dies;
- and
- disposing at least one portion of a heat dissipating device into the cavity of each die.
2 more elements
Dependencies are inferred from the claim text.