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US 2007/0166877 A1Published application
Electronic component and method for its assembly
AssigneeInfineon Technologies AG
InventorRalf Otremba
Life of this patent
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Abstract
An electronic component and method for its assembly is disclosed. In one embodiment, the electronic component comprises at least two semiconductor components and a circuit carrier comprising a die pad and a rewiring structure. At least one semiconductor component is a vertical semiconductor power switch having an upper surface comprising at least one electrode and a lower surface comprising at least one electrode. The lower side of the at least two semiconductor components is attached to the die pad by a diffusion solder bond.
Claims44
An electronic component comprising:
- at least two semiconductor components, each semiconductor component comprising an upper side and a lower side, wherein at least one semiconductor component is a vertical semiconductor power switch, the upper surface of the vertical semiconductor power switch comprising at least one electrode and the lower surface of the vertical semiconductor power switch comprising at least one electrode;
- and
- a circuit carrier comprising a die pad and a rewiring structure wherein lower side of the at least two semiconductor components is attached to the die pad by a diffusion solder bond.
An electronic component comprising:
- at least two semiconductor components, each semiconductor component comprising an upper side and a lower side, wherein at least one semiconductor component is a vertical semiconductor power switch, the upper surface of the vertical semiconductor power switch comprising at least one electrode and the lower surface of the vertical semiconductor power switch comprising at least one electrode;
- and
- a circuit carrier comprising a die pad and a rewiring structure wherein lower side of the at least two semiconductor components is attached to the die pad by a diffusion solder bond, and
- wherein the electronic component comprises a diode and the vertical semiconductor power switch is one of a MOSFET or a IGBT.
1 more element
An electronic component comprising:
- at least two semiconductor components, each semiconductor component comprising an upper side and a lower side, wherein at least one semiconductor component is a vertical semiconductor power switch, the upper surface of the vertical semiconductor power switch comprising at least one electrode and the lower surface of the vertical semiconductor power switch comprising at least one electrode;
- and
- a circuit carrier comprising a die pad and a rewiring structure wherein lower side of the at least two semiconductor components is attached to the die pad by a diffusion solder bond, and
- wherein the electronic component comprises at least two vertical semiconductor power switches, wherein the semiconductor power switches are one of a MOSFET and a IGBT.
1 more element
A method of assembling an electronic component, comprising:
- providing at least two semiconductor components, each semiconductor component comprising an upper side and a lower side, wherein at least one semiconductor component is a vertical semiconductor power switch, the upper surface of the vertical semiconductor power switch comprising at least one electrode and the lower surface of the vertical semiconductor power switch comprising at least one electrode, and wherein means for producing a diffusion solder bond is disposed on the lower side of each of the semiconductor components;
- providing a circuit carrier comprising a die pad and a rewiring structure;
- heating the circuit carrier to a selected temperature;
- applying the lower side of a first semiconductor component to the die pad of the circuit carrier while the circuit carrier is at the selected temperature;
- producing a diffusion solder bond between the first semiconductor component and the die pad;
- applying the lower side of a second semiconductor component to the die pad of the circuit carrier while the circuit carrier is at the selected temperature;
- and
- producing a diffusion solder bond between the second semiconductor component and the die pad.
5 more elements
An electronic component comprising:
- means for providing at least two semiconductor components, each semiconductor component comprising an upper side and a lower side, wherein at least one semiconductor component is a vertical semiconductor power switch, the upper surface of the vertical semiconductor power switch comprising at least one electrode and the lower surface of the vertical semiconductor power switch comprising at least one electrode;
- and
- means for providing a circuit carrier comprising a die pad and a rewiring structure wherein lower side of the at least two semiconductor components is attached to the die pad by a diffusion solder bond.
Dependencies are inferred from the claim text.