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US 2007/0166876 A1Published application
Components, methods and assemblies for multi-chip packages
AssigneeTessera, Inc.
InventorsYoung-Gon Kim, David Gibson, Michael Warner, Philip Damberg, Philip Osborn
Life of this patent
Estimating the term…
Abstract
An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.
Claims5
A method for mounting a warped multi-chip module to a circuit board, the method comprising the steps of:
- positioning a warped multi-chip module over a circuit board for mounting thereto;
- and
- raising a temperature of the warped multi-chip module to a temperature such that the warped multi-chip module relatively flattens and mounting masses reflow for electrically and mechanically bonding the now relatively flat multi-chip module to the circuit board.
Dependencies are inferred from the claim text.