Integrated circuit package system with image sensor system
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Chow, Heap Hoe Kuan
Life of this patent
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Abstract
An integrated circuit package system is provided including providing a wafer including image sensor systems having interconnects connected thereto and encapsulating the image sensor systems and interconnects in a transparent encapsulant. The system includes removing a portion of the transparent encapsulant to expose portions of the interconnects and singulating the wafer to form image sensor devices including at least one of the image sensor systems and a number of the interconnects.
Claims20
An integrated circuit package system comprising:
- providing a wafer including image sensor systems having interconnects connected thereto;
- encapsulating the image sensor systems and the interconnects in a transparent encapsulant;
- removing a portion of the transparent encapsulant to expose portions of the interconnects;
- and
- singulating the wafer to form image sensor devices including at least one of the image sensor systems and a number of the interconnects.
An integrated circuit package system comprising:
- an integrated circuit die including an image sensor system having interconnects connected thereto;
- and
- a transparent encapsulant on the integrated circuit die and encapsulating the image sensor system and the interconnects, the transparent encapsulant having a portion of the transparent encapsulant removed to expose portions of the interconnects and to comprise an image sensor device.
An integrated circuit package system comprising:
- an integrated circuit die including image sensor systems having interconnects connected thereto;
- and
- a transparent encapsulant encapsulating the image sensor systems and the interconnects in a transparent encapsulant, the transparent encapsulant having a notch to expose portions of the interconnects and to comprise an image sensor device.
Dependencies are inferred from the claim text.