Method for forming mirror devices for a digital light process apparatus
AssigneeDongbu Electronics Co., Ltd.
InventorDuck-Joong Kim
Life of this patent
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Abstract
A method for forming mirror devices for a DLP apparatus. The method includes: forming a lower metal layer as wiring for driving a micromirror that perform light switching operation on a screen sensor; forming a lower inter-metal dielectric layer over the lower metal layer; forming a light path blocking plate on the lower inter-metal dielectric to cover the lower metal layer; forming an upper inter-metal dielectric over the light path blocking plate; forming an upper metal layer on the upper inter-metal dielectric layer as additional wiring; and forming a surface ARC layer over the upper metal layer.
Claims8
A method for forming mirror devices for a Digital Light Process (DLP) apparatus, the method comprising:
- forming a lower metal layer as wiring for driving a micromirror that perform a light switching operation on a screen sensor;
- forming a lower inter-metal dielectric layer over the lower metal layer;
- forming a light path blocking plate on the lower inter-metal dielectric to cover the lower metal layer;
- forming an upper inter-metal dielectric layer over the light path blocking plate;
- forming an upper metal layer on the upper inter-metal dielectric layer as additional wiring;
- and
- forming a surface Anti-Reflective Coating (ARC) layer over the upper metal layer.
A digital light process (DLP) apparatus, comprising:
- a screen sensor;
- a plurality of micromirrors for performing a light switch operation on the screen sensor;
- and
- a mirror drive unit for driving the micromirrors, the mirror drive unit further comprising:
- a lower metal layer for driving one of the micromirrors,
- a lower inter-metal dielectric layer formed over the lower metal layer,
- a light path blocking plate formed on the lower inter-metal dielectric covering the lower metal layer,
- an upper inter-metal dielectric formed on the lower inter-metal dielectric, the upper inter-metal dielectric layer being patterned to expose the light path blocking plate,
- an upper metal layer formed on the patterned upper inter-metal dielectric layer as additional wiring, and
- a surface anti-reflective coating (ARC) layer covering the upper metal layer.
Dependencies are inferred from the claim text.