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US 2007/0166853 A1Published application
LED Arrangement
AssigneeOSRAM Opto Semiconductors GmbH
InventorsEwald Guenther, Gunter Waitl, Herbert Brunner, Jorg Strauss
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Abstract
The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.
Claims14
A method of fabricating an LED arrangement, comprising the following steps in the following order:
- a) preparing a carrier,
- b) attaching to said carrier an LED chip comprising a radiation decoupling surface,
- c) embedding said LED chip in a housing,
- d) applying a phosphor layer to said decoupling surface of the LED chip.
1 more element
Dependencies are inferred from the claim text.