Method for modifying circuit within substrate

Abstract

The present invention relates to a method for modifying a circuit within a substrate, and the circuit includes a plurality of electrodes. The method includes: (a) selecting at least two from the plurality of electrodes for making connection; (b) removing materials covering said selected electrodes with a focused ion beam (FIB) or a laser to form contact holes for respectively exposing said selected electrodes; (c) depositing in said contact holes a conductive material for forming electrically conductive piers by applying said focused ion beam (FIB) or a laser with gas molecules ejected from a nozzle; (d) disposing an electrically conductive viscid material over each of said electrically conductive piers; and (e) disposing an electrically conductive bridge floor to connect with each of the electrically conductive viscid material to form an electrically conductive bridge.

Dependencies are inferred from the claim text.