Photosensitive resin composition, and cured product and use thereof

Abstract

The invention relates to a photosensitive resin composition comprising (A) an epoxy(meth)acrylate resin synthesized from components containing (a) epoxy prepolymer, (b) an unsaturated group-containing monocarboxylic acid and (c) an acid anhydride, (B) a urethane (meth)acrylate resin synthesized from components containing (d) a dihydroxyl compound having a carboxyl group, (e) a polyol compound having an number average molecular weight of 200 to 20,000, (f) a hydroxyl compound having a (meth)acryloyl group and (g) diisocyanate compound, (C) an epoxy resin, (D) a diluent, (E) a photopolymerization initiator and if appropriate (F) inorganic ion exchanger, and cured product and use thereof. The photosensitive resin composition of the invention having good photosensitivity, developability, flexibility and property exhibiting excellent HHBT performance can be suitably used in printed circuit boards.

Dependencies are inferred from the claim text.