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AssigneeArisawa Mfg. Co., Ltd.
InventorsMakoto Tai, Shu Dobashi
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The present invention provides a polyamideimide resin for flexible printed circuit boards that prior to curing exhibits an excellent solubility, processability, and handling characteristics, and that after curing exhibits flame retardancy, solder heat resistance, circuit embeddability, and flexibility and further has a high glass-transition temperature (Tg) and is able to maintain a high adhesive strength. The present invention provides a polyamideimide resin for flexible printed circuit boards, which is obtained by the polymerization reaction of an acid component comprising at least a monoanhydride and an aromatic dicarboxylic acid with a diisocyanate compound or diamine compound in an approximately equimolar amount with respect to the total molar amount of the acid component, wherein the molar amount of the monoanhydride is 0.4 to 0.8 taking the total molar amount of the acid component as 1.
A polyamideimide resin for flexible printed circuit boards, which is obtained by the polymerization reaction of an acid component comprising at least a monoanhydride and an aromatic dicarboxylic acid with a diisocyanate compound or diamine compound in an approximately equimolar amount with respect to the total molar amount of the acid component, wherein the molar amount of the monoanhydride is 0.4 to 0.8 taking the total molar amount of the acid component as 1.
A polyamideimide resin for flexible printed circuit boards, which is obtained by the polymerization reaction of an acid component comprising at least a monoanhydride, an aromatic dicarboxylic acid, and an aliphatic dicarboxylic acid with a diisocyanate compound or diamine compound in an approximately equimolar amount with respect to the total molar amount of the acid component, wherein, taking the total molar amount of the acid component as 1, the molar amount of the monoanhydride is 0.5 to 0.8, the molar amount of the aromatic dicarboxylic acid is 0.1 to 0.4, and the molar amount of the aliphatic dicarboxylic acid is 0.05 to 0.2.
A polyamideimide resin for flexible printed circuit boards, which is obtained by the polymerization reaction of an acid component comprising at least a dianhydride and an aromatic dicarboxylic acid with a diisocyanate compound or diamine compound in an approximately equimolar amount with respect to the total molar amount of the acid component, wherein the molar amount of the dianhydride is 0.2 to 0.4 taking the total molar amount of the acid component as 1.
Dependencies are inferred from the claim text.