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US 2007/0166535 A1Published application
Thermoplastic polyimide composition and double-sided flexible copper clad laminate using the same
AssigneeIndustrial Technology Research Institute
InventorsCharng-Shing Lu, Jinn-Shing King, Shu-Shu Shih
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Abstract
A thermoplastic polyimide composition characterized by improved thermal resistance, adhesion and flatness for use in copper clad laminates. The polyimide contains repeating units represented by the formulae I and II, wherein each of Ar1 and Ar2, independently, represents a bivalent aromatic group, and X represents a quadrivalent aromatic group.
Claims12
A thermoplastic polyimide composition, comprising:
- a thermoplastic polyimide copolymer having repeating units represented by formulae I and II, and the mole fraction of the repeating unit of formula I being at least 10%,
- wherein each of Ar1 and Ar2, independently, represents a bivalent aromatic group, and X represents a quadrivalent aromatic group.
Dependencies are inferred from the claim text.