Glass material for use at high frequencies
AssigneeSchott AG
InventorsJurgen Leib, Dietrich Mund
Life of this patent
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Abstract
To improve the radio-frequency properties of radio-frequency substrates or radio-frequency conductor arrangements, the invention proposes a glass material for producing insulation layers for radio-frequency substrates or radio-frequency conductor arrangements, which, as an applied layer, in particular with a layer thickness in the range between 0.05 μm and 5 mm, has a loss factor tan δ of less than or equal to 70*10−4 in at least a frequency range above 1 GHz.
Claims40
A glass material for producing insulation layers for radio-frequency substrates or radio-frequency conductor arrangements, comprising:
- a composition, in percent by weight, of:
- SiO2 71±5,
- B2O3 26±5,
- Al2O3 1±0.2,
- K2O 1±0.2,
- Li2O 0.5±0.2,
- Na2O 0.5±0.2, and
- a layer thickness in the range between 0.05 μm and 5 mm, wherein the glass material has a loss factor tan δ of less than or equal to 70*10−4 in at least a frequency range above 1 GHz.
An insulation layer for radio-frequency substrates or radio-frequency conductor arrangements, comprising:
- a glass material having a layer thickness in the range between 0.05 μm and 5 mm;
- and
- a loss factor tan δ of less than or equal to 70*10−4 in at least one frequency range above 1 GHz.
(canceled)
A process for producing a component with a radio-frequency conductor arrangement, comprising the steps of:
- depositing a structured glass layer having at least one opening over a contact-connection region on a substrate;
- and
- applying at least one conductor structure to the structured glass layer, wherein the at least one conductor structure has electrical contact with the contact-connection region.
A component having a radio-frequency conductor arrangement, comprising:
- a substrate having at least one contact-connection region;
- a glass layer on at least one side of the substrate, the glass layer having at least one opening with a via in electrical contact with the contact-connection region, the glass layer having a composition, in percent by weight, comprising SiO2 40 to 90, B2O3 10 to 40, Al2O3 0 to 5, K2O 0 to 5, Li2O 0 to 3, and Na2O 0 to 3;
- and
- at least one conductor structure on the glass layer, the at least one conductor structure being in contact with the via.
40-56. (canceled)
Dependencies are inferred from the claim text.