Dicing/die bonding film and method of manufacturing the same
OwnerManabu Sutoh, Yoshito Ushioinventors
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Abstract
A dicing/die bonding sheet is made by joining a base film (1) and a silicone based adhesive agent layer (3) through the medium of an undercoat layer (2). This all-in-one dicing/die bonding sheet exhibits superior long-term storage stability and prevents chip delamination during dicing.
Claims20
A dicing/die bonding sheet adhesively bonded to a semiconductor wafer prior to the dicing of said semiconductor wafer, wherein said dicing/die bonding sheet is provided with a base film, an undercoat layer formed on said base film, and a silicone based adhesive agent layer formed on said undercoat layer and having an adhesive surface adhesively bonded to said semiconductor wafer.
Dependencies are inferred from the claim text.