Optical circuit fabrication method and device
AssigneeQinetiq Limited
InventorsRichard Jenkins, Mark McNie
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Abstract
A photonic light circuit device is described that comprises a semiconductor substrate (220) and two or more optical components (226, 228, 236, 240) wherein one or more hollow core optical waveguides (230, 232, 224) are formed in the semiconductor substrate to optically link said two or more optical components. The PLC may comprise a lid portion (44) and a base portion (42). The PLC can be adapted to receive optical components (8: 608) or optical components may be formed monolithically therein. Coating with a reflective layer is also described.
Claims44
(canceled)
(canceled)
(canceled)
A device as claimed in 18 in which the rectangular hollow core optical waveguide has a first cross-sectional dimension parallel to a first waveguide wall and a second cross-sectional dimension orthogonal to said first cross-sectional dimensional wherein the first cross-section dimension is at least 10% greater than the second cross sectional dimension.
A method of fabricating a photonic light circuit device in a semiconductor substrate, said method comprising the steps of:
- micro-fabricating at least one hollow channels and a plurality of alignment slots in said semiconductor substrate wherein the at least one hollow channel comprises at least one hollow core optical waveguides and each of the plurality of alignment slots completely and passively aligns an optical component retained therein, each of time plurality of alignment slots intersects a longitudinal axis of said at least one hollow waveguide within the plane of the substrate.
Dependencies are inferred from the claim text.