Optical input substrate, optical output substrate, optical input/output substrate, a fabrication method for these substrates, and an optical element integrated semiconductor integrated circuit

An optical input/output substrate, which is a substrate on which a semiconductor integrated circuit can be mounted;

• comprising:
• two or more photodetectors capable of converting optical signals that are received as input to electrical signals and supplying these electrical signals to a mounted semiconductor integrated circuit;
• and
• two or more light-emitting devices capable of converting electrical signals that supplied as output from a mounted semiconductor integrated circuit to optical signals and supplying these optical signals as output;
• wherein the heights of said two or more photodetectors are identical, and moreover, the heights of said two or more light-emitting devices are identical.

A fabrication method of an optical input substrate on which are mounted two or more photodetectors for converting received optical signals to electrical signals, said fabrication method comprising photodetector mounting steps that include steps of:

• forming bumps on only necessary photodetectors of a photodetector array;
• using said bumps to mount said photodetector array on a substrate to thus connect photodetectors on which said bumps have been formed to input ports of said substrate;
• covering said photodetectors that have been connected to said input ports with a protective film;
• removing unnecessary photodetectors that are not covered with said protective film from said photodetector array;
• and
• removing said protective film.

A fabrication method of an optical output substrate on which are mounted two or more light-emitting devices for converting received electrical signals to optical signals, said fabrication method comprising light-emitting device mounting steps that include steps of:

• covering only necessary light-emitting devices among a light-emitting device array with a protective film;
• removing the functional portions of unnecessary light-emitting devices that are not covered by said protective film;
• removing said protective film;
• and
• mounting said light-emitting device array in which the functional portions of said unnecessary light-emitting devices have been removed on a substrate, and connecting said necessary light-emitting devices to output ports of said substrate.

A fabrication method of an optical output substrate on which are mounted two more light-emitting devices for converting received electrical signals to optical signals, said fabrication method comprising light-emitting device mounting steps that include steps of:

• covering only necessary light-emitting devices in a light-emitting device array with a protective film;
• removing unnecessary light-emitting devices that are not covered by said protective film together with the element substrate;
• removing said protective film;
• and
• mounting said light-emitting device array in which said unnecessary light-emitting devices have been removed on a substrate and connecting said necessary light-emitting devices to output ports of said substrate.

A fabrication method of an optical input/output substrate on which are mounted both photodetectors and light-emitting devices, said fabrication method comprising:

• photodetector mounting steps that include steps of:
• forming bumps on only necessary photodetectors in a photodetector array;
• using said bumps to mount said photodetector array on a substrate and thus to connect photodetectors on which said bumps have been formed to input ports of said substrate;
• covering said photodetectors that have been connected to said input ports with a protective film;
• removing unnecessary photodetectors that are not covered by said protective film from said photodetector array;
• and
• removing said protective film;
• and
• light-emitting device mounting steps that include steps of:
• covering only necessary light-emitting devices in a light-emitting device array with a protective film;
• removing the functional portions of unnecessary light-emitting devices that are not covered by said protective film;
• removing said protective film;
• and
• mounting on a substrate said light-emitting device array in which the functional portions of said unnecessary light-emitting devices have been removed, and connecting said necessary light-emitting devices to output ports of said substrate.

A fabrication method of an optical input/output substrate on which both photodetectors and light-emitting devices are mounted, said fabrication method comprising:

• photodetector mounting steps that include steps of:
• forming bumps on only necessary photodetectors in a photodetector array;
• using said bumps to mount said photodetector array on a substrate to thus connect photodetectors on which said bumps have been formed to input ports of said substrate;
• covering said photodetectors that have been connected to said input ports with a protective film;
• removing unnecessary photodetectors that have not been covered by said protective film from said photodetector array;
• and
• removing said protective film;
• and
• light-emitting device mounting steps that include steps of:
• covering only necessary light-emitting devices in a light-emitting device array with a protective film;
• removing unnecessary light-emitting devices that have not been covered by said protective film together with the element substrate;
• removing said protective film;
• and
• mounting said light-emitting device array from which said unnecessary light-emitting devices have been removed, and connecting said necessary light-emitting devices to output ports of said substrate.