High-power LED package structure
OwnerChia-Mao Liinventor
Life of this patent
Estimating the term…
Abstract
A high-power LED package structure applied to spot lights, torch lights, structures that provide ultraviolet or infrared or white lights. The high-power LED package structure comprises at least one light emitting diode chip attached to an outer surface of a metallic heat sink of high heat conductivity. The structure further comprises a heat-conducting base on which the metallic heat sink is embedded. There is an insulating layer between the metallic heat sink and the heat-conducting base. The tri-structure significantly increases the mechanical toughness and the heat-conducting area of the present invention, whereby the heat produced in the metallic heat sink will be diffused quickly to the heat-conducting base and then dissipated away. Therefore, the effect of heat dissipation will be enhanced.
Claims9
A high-power LED package structure, comprising:
- a lens;
- a lamb shade cup;
- a light-emitting diode (LED) chip array used as a light source having at least one LED chip;
- a metallic heat sink on which said LED chip array is embedded having a volume much larger than said LED chip array, a top surface of said metallic heat sink further including said lamp shed cup covered with said lens, said lens having a preset curvature for projecting light in a predetermined angle;
- and
- a heat-conducting base on which said metallic heat sink is mounted, a heat-conducting insulating layer being disposed between said heat-conducting base and said metallic heat sink, whereby the mechanical toughness, electric insulating and heat conduction of said high-power LED package structure will be enhanced;
- whereby the heat generated in said LED chip array will be quickly transferred to said metallic heat sink and then to said heat-conducting base, and whereby said LED chip array will support a higher electric current and have brighter light intensity.
Dependencies are inferred from the claim text.