LED lighting system with reflective board
AssigneeLumination LLC
InventorsStanton Weaver, Thomas Stecher
Life of this patent
Estimating the term…
Abstract
A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.
Claims21
A light emitting apparatus comprising:
- one or more light emitting chips emitting radiation predominantly in a wavelength range above about 470 nanometers;
- and
- a circuit board on which the one or more light emitting chips are disposed, the circuit board including:
- (i) an electrically insulating board, (ii) electrically conductive circuitry, and (iii) an electrically insulating solder mask having vias through which the one or more light emitting chips electrically contact the circuitry, the solder mask having a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers, the solder mask including an electrically insulating binder material and a filler material dispersed in the binder material, the filler-material having reflectance greater than about 85% at least between about 400 nanometers and about 470 nanometers.
A light emitting apparatus comprising:
- one or more light emitting chips emitting radiation predominantly in a wavelength range above about 470 nanometers;
- and
- a circuit board on which the one or more light emitting chips are disposed, the circuit board including:
- (i) an electrically insulating board, (ii) electrically conductive circuitry, and (iii) an electrically insulating solder mask comprising a multiple layer specular reflector sheet and having vias through which the one or more light emitting chips electrically contact the circuitry, the solder mask having a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.
A method for fabricating a light emitting apparatus, the method comprising:
- providing an electrically insulating board including electrically conductive circuitry;
- disposing an electrically insulating solder mask having a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers on the electrically insulating board by combining constituents of a photosensitive epoxy with a reflective filler material to generate epoxy source material, the reflective filler having a reflectance greater than about 85% at least between 400 nanometers and 470 nanometers, disposing the epoxy source material on the electrically insulating board to define an epoxy solder mask layer, and photolithographically forming the vias accessing the circuitry in the epoxy solder mask layer;
- and
- disposing one or more light emitting chips on the insulating solder mask, the one or more light emitting chips electrically contacting the circuitry through the vias in the solder mask, the one or more light emitting chips emitting radiation predominantly in a wavelength range above about 470 nanometers.
Dependencies are inferred from the claim text.