Printed circuit board
AssigneeSamsung Electronics Co., Ltd.
InventorsByoung-Ha Oh, Hwa-Jin Jung
Life of this patent
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Abstract
An improved printed circuit board (PCB) includes first and second substrates, which are disposed being distanced or spaced mutually and in which at least one or more semiconductor chips are mounted, and a signal transmission part for providing a signal transmission path between the first and second substrates, the signal transmission part being extended out of a region having a size smaller than a maximum size of the first substrate within the first substrate, and being extended in the second substrate. In disposing two substrates in a spaced-apart structure of upper and lower positions, a length of flexible printed circuit (FPC) connecting the two substrates can be reduced, and an impedance mismatching caused in use of the FPC can be reduced.
Claims20
A printed circuit board (PCB), comprising:
- spaced-apart first and second substrates;
- a signal transmission element connecting the first and second substrates;
- wherein
- the signal transmission element extends along an axis from a region of the first substrate that is along the axis, the region having a size smaller than a maximum size of the first substrate within the first substrate, wherein the signal transmission element protrudes through an opening portion of the first substrate, the opening portion along the axis, and adjacent to the region of the first substrate, and wherein the signal transmission element is extended in the second substrate.
A PCB comprising:
- first and second substrates that are disposed being distanced from each other and that each have at least one electronic part;
- and
- a signal transmission element for providing a signal transmission path between the first and second substrates, the signal transmission element extending along an axis from a region of the first substrate that is along the axis, the region having a size smaller than a maximum size of the first substrate within the first substrate, the signal transmission element protruding through an opening portion of the first substrate, the opening portion along the axis, and adjacent to the region of the first substrate, and the signal transmission element is extended in the second substrate.
A PCB having a mutually distanced structure of first and second substrates through use of a signal transmission element, wherein the second substrate is disposed over the first substrate, the signal transmission element extends along an axis from a region of the first substrate that is along the axis, the region having a size smaller than a maximum size of the first substrate within the first substrate, wherein the signal transmission element protrudes through an opening portion of the first substrate, the opening portion along the axis, and adjacent to the region of the first substrate, and wherein the signal transmission element is extended out of a region of the second substrate having a size smaller than a maximum size of the second substrate within the second substrate.
A PCB, comprising:
- one substrate on which at least one electronic part is mounted, and
- a signal transmission element for providing a signal transmission path of the substrate, the signal transmission element extending along an axis from a region of the substrate that is along the axis, the region having a size smaller than a maximum size of the substrate within the substrate, wherein the signal transmission element protrudes through an opening portion of the substrate, the opening portion along the axis, and adjacent to the region of the substrate.
Dependencies are inferred from the claim text.