Printed circuit board assembly
AssigneeSamsung Electronics Co., Ltd.
InventorSeung-young Ahn
Life of this patent
Estimating the term…
Abstract
A printed circuit board assembly includes: a substrate; a main signal line formed on the substrate to transmit a signal; an SMD mounted on the substrate; a pad interposed between the SMD and the substrate; and a sub signal line provided on the substrate to electrically connect the main signal line with the pad, and having a width different from that of the main signal line. Thus, the printed circuit board assembly transmits a signal at a high speed and enhancing reliability and an economical efficiency of a product using the printed circuit board assembly.
Claims29
A printed circuit board assembly, comprising:
- a substrate;
- a main signal line formed on the substrate to transmit a signal;
- a surface mounted device (SMD) mounted on the substrate;
- a pad interposed between the SMD and the substrate;
- and
- a sub signal line provided on the substrate to electrically connect the main signal line with the pad, and having a width different from a width of the main signal line.
A printed circuit board assembly, comprising:
- a substrate provided with at least one layer;
- a surface mounted device (SMD) mounted on a first side of the layer of the substrate;
- a pad mounted on the first side between the SMD and the substrate;
- a main signal line provided on a second side of the layer of the substrate to transmit a signal;
- and
- a sub signal line electrically connecting the main signal line with the pad, and having a width different from a width of the main signal line.
A printed circuit board assembly for use with a surface mounted device (SMD), comprising:
- a substrate;
- a pad on the substrate and on which the SMD is mountable;
- a main signal line on the substrate and having a parasitic capacitance when a signal is transmitted between the main signal line and the pad;
- and
- a sub signal line connecting the main signal line and the pad and through which the signal passes between the main signal line and the pad, the sub signal line being shaped to produce an inductance to offset the parasitic capacitance during transmission of the signal.
A method of manufacturing a printed circuit board assembly for use with a surface mounted device (SMD), the method comprising:
- forming a pad on a substrate, the SMD being mountable on the pad;
- forming a main signal line on the substrate, the formed main signal line having a parasitic capacitance when a signal is transmitted between the main signal line and the pad;
- and
- connecting a sub signal line between the main signal line and the pad through which the signal passes between the main signal line and the pad during transmission, the sub signal line being shaped to produce an inductance to offset the parasitic capacitance during transmission of the signal.
Dependencies are inferred from the claim text.