Digital camera module using stacked chip package
AssigneeAltus Technology Inc.
InventorsYing-Cheng Wu, Ying-Tang Su
Life of this patent
Estimating the term…
Abstract
A digital camera module (10) includes a chip package (101) and a lens module (103) mounted on the chip package. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.
Claims17
A digital camera module, comprising:
- a chip package, comprising:
- a substrate having a plurality of top contacts arranged thereon;
- a first chip attached to the substrate, the first chip including a plurality of first pads disposed on an upper surface thereof;
- a second chip disposed above the first chip, the second chip comprising a bottom surface facing the first chip and an upper surface provided with a plurality of second pads thereon;
- a plurality of wires, the wires respectively electrically connecting one of the first and second contacts to corresponding top contacts of the substrate, each wire forming a wire loop;
- and
- a cover disposed above the second chip, the cover having a bottom surface facing the second chip;
- wherein the bottom surface of the second chip is positioned above the wire loops of the wires connected with the first chip, and the bottom surface of the cover is above the wire loops of the wires connected with the second chip;
- and
- a lens module mounted to the chip package.
A digital camera module, comprising:
- a chip package, comprising:
- a substrate;
- a first chip mounted on the substrate, the first chip being electrically connected with the substrate via a first plurality of wires;
- a second chip mounted above the first chip and the wires connected with the first chip, the second chip being electrically connected with the substrate via a second plurality of wires;
- and
- a cover mounted above the second chip and the wires connected with the second chip;
- and
- a lens module mounted to the chip package.
Dependencies are inferred from the claim text.