Flexible circuits having ink-resistant covercoats
Assignee3M Innovative Properties Company
InventorsRonald L. Imken, Thach G. Truong
Life of this patent
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Abstract
A circuit article for use with an inkjet printer pen. The circuit article comprises a flexible circuit having a plurality of conductive traces disposed on a dielectric film, an adhesive film disposed adjacent the dielectric film of the flexible circuit, and a carrier film disposed adjacent the first adhesive film, opposite of the flexible circuit. The adhesive film is derived from a cross-linkable precursor comprising an epoxidized aromatic-diene block copolymer and a thermal-curing agent.
Claims30
A circuit article for use with an inkjet printer pen, the circuit article comprising:
- a flexible circuit having a plurality of conductive traces disposed on a dielectric film;
- an adhesive film disposed adjacent the dielectric film of the flexible circuit, the adhesive film being derived from a cross-linkable precursor comprising an epoxidized aromatic-diene block copolymer and a thermal-curing agent;
- and
- a carrier film disposed adjacent the adhesive film, opposite of the flexible circuit.
An inkjet printer pen comprising:
- a pen body configured to store and dispense ink;
- a carrier film adhered to the pen body;
- an adhesive film disposed adjacent the carrier film, opposite the body, wherein the adhesive film is derived from a cross-linkable precursor comprising an epoxidized aromatic-diene block copolymer and a thermal-curing agent;
- a flexible circuit having a plurality of conductive traces disposed on a dielectric film, the dielectric film being disposed adjacent the adhesive film.
A method of forming a circuit article for use with an inkjet printer pen body, the method comprising:
- coating a cross-linkable precursor onto a carrier film, the cross-linkable precursor comprising an epoxidized styrene-diene block copolymer and a thermal-curing agent;
- laminating a flexible circuit adjacent the cross-linkable precursor, wherein the flexible circuit has a plurality of conductive traces that are encapsulated by the cross-linkable precursor;
- and
- thermal curing the cross-linkable precursor.
Dependencies are inferred from the claim text.