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US 2007/0164788 A1Published application
Semiconductor device and electric apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsShigeru HIURA, Takaya Kitahara, Masanori Kinugasa, Akira Takiba, Masaru Mizuta, Kiyoyasu Shibata
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Abstract
A semiconductor device of an embodiment of the invention has a package substrate, and a semiconductor chip mounted on the package substrate. The semiconductor chip has an output section, and a filter section for decreasing the electromagnetic noise generated from the data communication path. The output section outputs a data signal into the data communication path, and has a buffer amplifier section for compensating the data signal.
Claims16
A semiconductor device comprising:
- a package substrate;
- and
- a semiconductor chip mounted on the package substrate, the semiconductor chip comprising:
- an output section which outputs a data signal into a data communication path and has a buffer amplifier section which compensates the data signal;
- and a filter section which decreases an electromagnetic noise generated from the data communication path.
2 more elements
Dependencies are inferred from the claim text.