On-chip electromigration monitoring system
AssigneeInternational Business Machines Corporation
InventorsLouis Hsu, Hayden Cranford, Oleg Gluschenkov, James Mason, Michael Sorna, Chih-Chao Yang
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AssigneeInternational Business Machines Corporation
InventorsLouis Hsu, Hayden Cranford, Oleg Gluschenkov, James Mason, Michael Sorna, Chih-Chao Yang
Estimating the term…
A packaged semiconductor chip is provided which includes a semiconductor chip and a package element. The semiconductor chip includes a plurality of semiconductor devices and a plurality of conductive features disposed at an exterior face of the semiconductor chip. The package element has a plurality of external features conductively connected to the plurality of conductive features of the semiconductor chip. The semiconductor chip includes a monitored element including a conductive interconnect that conductively interconnects a first node of the semiconductor chip to a second node of the semiconductor chip. A detection circuit in the semiconductor chip is operable to compare a variable voltage drop across the monitored element with a reference voltage drop across a reference element on the chip at a plurality of different times during a lifetime of the packaged semiconductor chip so as to detect when the resistance of the monitored element is over threshold.
A packaged semiconductor chip, comprising:
A method of detecting when a resistance of a monitored element including a conductive interconnect of a packaged semiconductor chip is over threshold during a lifetime of said packaged chip, comprising:
An apparatus in a semiconductor chip operable to detect an increase in resistance of a monitored element including a conductive interconnect, comprising:
A method of detecting an increase in resistance of a monitored element including a conductive interconnect of a semiconductor chip, comprising:
Dependencies are inferred from the claim text.