Circuit device
AssigneeSanyo Electric Co., Ltd.
InventorsMakoto Murai, Ryosuke Usui, Yasuhiro Kohara
Life of this patent
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Abstract
A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insulation board for installing the circuit element, and the heat sink, over which the insulation board is installed with a paste arranged therebetween. The insulation board has a projection arranged on the surface facing the heat sink along a peripheral portion. At least part of the projection contacts the heat sink through the paste layer.
Claims11
A circuit device comprising:
- a base member;
- a circuit board arranged over the base member, the circuit board having a peripheral portion and a first surface facing toward the base member;
- and
- a paste arranged between the circuit board and the base member;
- wherein the circuit board includes a projection arranged on the first surface along the peripheral portion, with at least part of the projection extending through the paste and contacting the base member.
Dependencies are inferred from the claim text.