Micro-electromechanical device
AssigneesAgency for Science, Technology and Research, Sony Corporation
InventorsKui Yao, Xiao Song Tang, Peng Gao, Xujiang He, Jian Zhang, Santiranjan Shannigrahi
Life of this patent
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Abstract
An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers.
Claims26
A method for fabricating an electromechanical device comprising:
- forming a support structure including
- providing a first layer,
- providing second and third layers, each having inner and outer surfaces,
- attaching inner surfaces of the second and third layers to the first layer to form the support structure, wherein the support structure comprises at least one cavity between the second and third layers;
- and
- providing an electromechanical active element on the outer surface of at least one of the second and third layers.
24 The method of any of claims 21-23 further comprises coating at least one side of the wafer stack to protect the electromechanical devices from damage during dicing.
An electromechanical device comprising:
- a support structure including a first layer, second and third layers, each having inner and outer surfaces, the inner surfaces of the second and third layers are attached to the first layer, wherein the support structure includes at least one cavity;
- and
- an electromechanical active element disposed on the outer surface of at least one of the second and third layers.
Dependencies are inferred from the claim text.