Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device
AssigneesElpida Memory, Inc., NEC Toppan Circuit Solutions, Inc.
InventorsMasahiro Yamaguchi, Hirofumi Nakamura
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Abstract
A semiconductor package comprising: a substrate containing a wiring pattern connected to a plurality of external electrodes; one or more semiconductor chips connected to the wiring pattern and mounted on the substrate; a conductive post connected to a predetermined the external electrode and functioning as a relay electrode in a vertical direction; and a resin sealing layer for integrally sealing the semiconductor chips and the conductive post in a state in which an upper end face of the conductive post is exposed.
Claims15
A semiconductor package comprising:
- a substrate containing a wiring pattern connected to a plurality of external electrodes;
- one or more semiconductor chips connected to said wiring pattern and mounted on said substrate;
- a conductive post connected to a predetermined said external electrode and functioning as a relay electrode in a vertical direction;
- and
- a resin sealing layer for integrally sealing said semiconductor chips and said conductive post in a state in which an upper end face of said conductive post is exposed.
A substrate with a conductive post comprising:
- a substrate containing a wiring pattern connected to a plurality of external electrodes;
- one or more lands formed on said conductive post and connected to one or more semiconductor chips;
- and
- a conductive post connected to a predetermined said external electrode and functioning as a relay electrode in a vertical direction.
A manufacturing method of a semiconductor package comprising the steps of:
- forming a substrate structure having a wiring pattern and a plurality external electrodes on one side of a conductive plate such that a predetermined said external electrode is connected to a position at which said conductive plate partially functions as a relay electrode;
- forming a conductive post on the other side of said conductive plate by using a portion at a location functioning as said relay electrode while removing the other portion;
- mounting one or more semiconductor chips on a surface of said substrate structure at a side on which said conductive plate is removed;
- sealing said one or more semiconductor chips and said conductive post integrally with a resin;
- and
- treating a surface of said resin so that an end face of said conductive post is exposed.
Dependencies are inferred from the claim text.