Power configuration method for structured ASICs
AssigneeLSI Corporation
InventorsAnwar Ali, Tauman Lau, Kalyan Doddapaneni
Life of this patent
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Abstract
A method for electrically coupling a bond pad of an integrated circuit such as a field programmable device, an application-specific integrated circuit, or a rapid chip with an input/output device is disclosed. The bond pad is provided with a plurality of metal layers configurable for making a connection with the input/output device. The bond pad is then coupled to the input/output device with an interconnect structure. The method for electrically coupling the bond pad to the input/output device allows the customer to configure the power and ground pad counts after the slice is created.
Claims20
A method for electrically coupling a bond pad of an integrated circuit with an input/output device comprising:
- providing the bond pad with at least two layers;
- and
- electrically coupling an interconnect structure to a layer of the at least two layers and to an input/output device.
A universal bond pad system for electrically coupling an integrated circuit to an input/output device comprising:
- a bond pad with at least two layers;
- and
- an interconnect structure for electrically coupling a layer of the at least two layers to the input/output device,
- wherein the input/output device is at least one of an input/output signal pin, an input/output power supply pin, an input/output ground supply pin, an input/output core power supply pin, or an input/output core ground supply pin.
A universal bond pad system for electrically coupling an integrated circuit to an input/output device comprising:
- a bond pad with at least two layers;
- a pad structure assembly for electrically coupling a layer of the at least two layers to an input/output device,
- wherein the pad structure assembly includes a pad structure for transferring an input/output power supply from the bond pad to the input/output device.
Dependencies are inferred from the claim text.