Integrated circuit having second substrate to facilitate core power and ground distribution
OwnerDonald Hawk, James Parkerinventors
Life of this patent
Estimating the term…
Abstract
An integrated circuit comprises a first substrate, an integrated circuit die attached to the first substrate, and a second substrate overlying at least a portion of the integrated circuit die. The second substrate comprises at least one conductor that is wire bonded to a conductor of the first substrate and electrically connected to a conductor of the integrated circuit die. In an illustrative embodiment, conductors of the second substrate are used to provide core power and ground connections for the integrated circuit die.
Claims21
An integrated circuit comprising:
- a first substrate;
- an integrated circuit die attached to the first substrate;
- and
- a second substrate overlying at least a portion of the integrated circuit die;
- the second substrate comprising at least one conductor that is wire bonded to a conductor of the first substrate and electrically connected to a conductor of the integrated circuit die.
An integrated circuit comprising:
- an integrated die coupled between first and second substrates;
- the first substrate comprising a ball grid array substrate supporting the integrated circuit die and wire bonded to the integrated circuit die and the second substrate;
- the second substrate comprising a flip-chip substrate overlying and in electrical contact with the integrated circuit die.
A method of forming an integrated circuit, the method comprising the steps of:
- attaching an integrated circuit die to a first substrate;
- providing a second substrate overlying at least a portion of the integrated circuit die;
- and
- wire bonding at least one conductor of the second substrate to a conductor of the first substrate, said conductor of the second substrate also being electrically connected to a conductor of the integrated circuit die.
Dependencies are inferred from the claim text.