Interconnects with interlocks
AssigneeIntel Corporation
InventorsJiun Sir, Eng Goh
Life of this patent
Estimating the term…
Abstract
Embodiments include interconnect of electrically conductive material with a contact surface, and a dielectric layer overlying the contact surface with a trench and via in the dielectric layer, the via extending to the contact surface. An interlock material is in the via with an interlock opening extending through the interlock material and into the interconnect. A layer of electroless material is on the base of the trench and the surfaces of the via, interlock material, and interlock opening. An subsequent interconnect is formed on the electroless material, in the trench, via, and interlock openings. The structure can be repeated to form a stack or column of interconnects that resist delamination.
Claims18
An apparatus comprising:
- an interlock opening in an interlock surface of an interlock material formed on a contact surface of a circuit device on a dielectric material, the circuit device having a first electrically conductive material, the interlock material having a second electrically conductive material,
- wherein the interlock opening has a plurality of interlock sidewalls extending through the interlock material, through the contact surface, and to an interlock base.
An apparatus comprising:
- an interlock opening in an interlock surface of an interlock material formed on a contact surface of a circuit device on a first dielectric material, the circuit device having a first electrically conductive material, the interlock material having a second electrically conductive material,
- wherein the interlock opening has a plurality of interlock sidewalls extending through the interlock material, through the contact surface, and to an interlock base;
- a second dielectric material overlying the circuit device and the first dielectric material;
- a via opening in the second dielectric material, the via opening having a plurality of via sidewalls and extending to the interlock surface;
- and
- an electroless material comprising a third electrically conductive
- material on the via sidewalls, on the interlock surface, on the interlock
- sidewalls, and on the interlock base.
Dependencies are inferred from the claim text.